Assembly and Printed Circuit Board (pcb) Package
نویسنده
چکیده
منابع مشابه
Product/process Design in Mass Placement Printed Circuit Board Assembly *
We describe a set of models that are used to manage the product and process design in a mass placement printed circuit board (PCB) assembly cell. Our models can be divided into two categories. First, we characterize the cell design problem and develop models to design an efficient assembly cell. Second, we present models for optimizing the different operational aspects of the assembly cell. The...
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0026-2714/$ see front matter 2013 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2013.03.014 ⇑ Corresponding author. Tel.: +1 416 978 5741; fax E-mail address: [email protected] (S.A. Me In this paper, we develop a new and computationally efficient multi-level approach to investigate board level drop reliability of printed circuit board (PCB) assembly. The approach is composed of two...
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T oday’s printed circuit board (PCB) assembly test engineers face significantly more test challenges than just a few years ago. Board complexity is dramatically increasing with more components, more joints, higher densities and new package technologies. The higher component and joint counts create more defect opportunities, which lead to lower yields for a given defect level. Fortunately, test ...
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This paper investigates the incorporation of optimization techniques early in the design process for the manufacturing process of printed circuit board (PCB) assembly. PCB design is a long process in which many sequential optimizations are performed with assembly optimization being the last. Since assembly optimization is not performed until the PCB design is completed it tends to be sub-optima...
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A Taylor series analysis is conducted to study the effects of the package and printed circuit board (PCB) on the intermodulation nulling of an RF common-emitter amplifier. The equivalent parasitic element of the package and PCB interconnects is extracted from the impedance and admittance parameters, which are obtained using a three-dimensional (3-D) electromagnetic simulation tool. The theoreti...
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